Doug Vining 3D Universal Memory

One of the key ingredients in this scenario for super-powerful energy-sipping mobile devices is the development of high capacity non-volatile memory, also known as Universal Memory chips that can replace flash and DRAM. Intel and Micron have announced theirs.
A FuturesForum post (titled: "3D Universal Memory") refers to this MindBullet. The full FuturesForum post can be read here:
Posted: 29 July 2015 at 14:52
Comments by users of MindBullets are those of the authors and are not necessarily shared, endorsed and/or warranted by FutureWorld. All MindBullet content is Copyright FutureWorld International © 2019. All Rights Reserved.