Doug Vining 3D Universal Memory

One of the key ingredients in this scenario for super-powerful energy-sipping mobile devices is the development of high capacity non-volatile memory, also known as Universal Memory chips that can replace flash and DRAM. Intel and Micron have announced theirs.
A FuturesForum post (titled: "3D Universal Memory") refers to this MindBullet. The full FuturesForum post can be read here: http://www.futureworld.org/PublicZone/FuturesForum/BlogDetails.aspx?PostID=7a08a3d0-79ac-44ec-9e2a-da0f55b7e232
Posted: 29 July 2015 at 14:52
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